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SNS's advanced non porous CVD dielectric films (used in ultra low k BEOL) as ILD, inter layer dielectric and inter metal dielectric materials and NanoGrowth technologies for low temperature, PTCVD and Photo Thermal PECVD carbon nanotube materials used as a copper damascene replacement in next generation advanced interconnects and vias for microelectronics.
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Construction & Tradesmen > Surveyors & Engineers > Electrical Engineers
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